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d a t a sh eet integrated circuits UAA3201t uhf/vhf remote control receiver product speci?cation supersedes data of 1995 may 18 file under integrated circuits, ic18 2000 apr 18
2000 apr 18 2 philips semiconductors product speci?cation uhf/vhf remote control receiver UAA3201t features oscillator with external surface acoustic wave resonator (sawr) wide frequency range from 150 to 450 mhz high sensitivity low power consumption automotive temperature range superheterodyne architecture applicable to fulfil ftz 17 tr 2100 (germany) high integration level, few external components inexpensive external components if filter bandwidth determined by application. applications car alarm systems remote control systems security systems gadgets and toys telemetry. general description the UAA3201t is a fully integrated single-chip receiver, primarily intended for use in vhf and uhf systems employing direct am return-to-zero (rz) amplitude shift keying (ask) modulation. quick reference data ordering information symbol parameter conditions min. typ. max. unit v cc supply voltage 3.5 - 6.0 v i cc supply current - 3.4 4.8 ma p ref input reference sensitivity f i(rf) = 433.92 mhz; data rate = 250 bits/s; ber 3 10 - 2 --- 105 dbm t amb ambient temperature - 40 - +85 c type number package name description version UAA3201t so16 plastic small outline package; 16 leads; body width 3.9 mm sot109-1
2000 apr 18 3 philips semiconductors product speci?cation uhf/vhf remote control receiver UAA3201t block diagram handbook, full pagewidth mhb679 oscillator if filter 16 14 15 fa 13 lin lfb cpc cpo osc ose mon mop cpa cpb buffer mixer v ee v em mixin rf_in band gap reference v cc v ref limiter if amplifier buffer UAA3201t comparator r1 data data c14 c7 c19 c17 c12 c13 10 11 12 9 7 68 v cc v cc 3 45 1 2 fig.1 block diagram. pinning symbol pin description mon 1 negative mixer output mop 2 positive mixer output v cc 3 positive supply voltage osc 4 oscillator collector ose 5 oscillator emitter v ee 6 negative supply voltage cpb 7 comparator input b cpa 8 comparator input a data 9 data output cpo 10 comparator offset adjustment cpc 11 comparator input c lfb 12 limiter feedback lin 13 limiter input mixin 14 mixer input v em 15 negative supply voltage for mixer fa 16 if ampli?er output UAA3201t med897 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 fa v em mixin lin lfb cpc cpo data mon mop v cc osc ose v ee cpb cpa fig.2 pin configuration.
2000 apr 18 4 philips semiconductors product speci?cation uhf/vhf remote control receiver UAA3201t functional description the rf signal is fed directly into the mixer stage where it is mixed down to nominal 500 khz if by the integrated oscillator controlled by an external sawr (see fig.1). the if signal is then passed to the if amplifier which increases the level. a 5th-order elliptic low-pass filter acts as main if filtering. the output voltage of that filter is demodulated by a limiter that rectifies the incoming if signal. the demodulated signal passes two rc filter stages and is then limited by a data comparator which makes it available at the data output. mixer the mixer is a single balanced emitter coupled pair with internally set bias current. the optimum impedance is 320 w at 430 mhz. capacitor c5 (see fig.9) is used to transform a 50 w generator impedance to the optimum value. oscillator the oscillator consists of a transistor in common base configuration and a tank circuit including the sawr. resistor r2 (see fig.9) is used to control the bias current through the transistor. resistor r3 is required to reduce unwanted responses of the tank circuit. if ampli?er the if amplifier is a differential input, single-ended output emitter coupled pair. it is used to decouple the first and the second if filter and to provide some additional gain in order to reduce the influence of the noise of the limiter on the total noise figure. if ?lters the first if filter is an rc filter formed by internal resistors and an external capacitor c7 (see fig.1). the second if filter is an external elliptic filter. the source impedance is 1.4 k w and the load is high-impedance. the bandwidth of the if filter in the application and test circuit (see fig.9) is 800 khz due to the centre frequency spread of the sawr. it may be reduced when sawrs with less tolerances are used or temperature range requirements are lower. a smaller bandwidth of the filter will yield a higher sensitivity of the receiver. as the rf signal is mixed down to a low if signal there is no image rejection possible. limiter the limiting amplifier consists of three dc coupled amplifier stages with a total gain of 60 db. a received signal strength indicator (rssi) signal is generated by rectifying the if signal. the limiter has a lower frequency limit of 100 khz which can be controlled by capacitors c12 and c19. the upper frequency limit is 3 mhz. comparator the 2 if component in the rssi signal is removed by the first order low-pass capacitor c17. after passing a buffer stage the signal is split into two paths, leading via rc filters to the inputs of a voltage comparator. the time constant of one path (c14) is compared to the bit duration. consequently the potential at the negative comparator input represents the average magnitude of the rssi signal. the second path with a short time constant (c13) allows the signal at the positive comparator input to follow the rssi signal instantaneously. this results in a variable comparator threshold, depending on the strength of the incoming signal. hence the comparator output is switched on, when the rssi signal exceeds its average value, i.e. when an ask on signal is received. the low-pass filter capacitor c13 rejects the unwanted 2 if component and reduces the noise bandwidth of the data filter. the resistor r1 is used to set the current of an internal source. this current is drawn from the positive comparator input, thereby applying an offset and driving the output into the off state during the absence of an input signal. this offset can be increased by lowering the value of r1 yielding a higher noise immunity at the expense of reduced sensitivity. band gap reference the band gap reference controls the biasing of the whole circuit. in this block currents are generated that are constant over the temperature range and currents that are proportional to the absolute temperature. the current consumption of the receiver rises with increasing temperature, because the blocks with the highest current consumption are biased by currents that are proportional to the absolute temperature.
2000 apr 18 5 philips semiconductors product speci?cation uhf/vhf remote control receiver UAA3201t limiting values in accordance with the absolute maximum rating system (iec 60134). note 1. human body model: equivalent to discharging a 100 pf capacitor through a 1.5 k w series resistor. thermal characteristics dc characteristics v cc = 3.5 v; all voltages referenced to v ee ; t amb = - 40 to +85 c; typical value for t amb =25 c; for test circuit see fig.9; sawr disconnected; unless otherwise speci?ed. note 1. i data is defined to be positive when the current flows into pin data. symbol parameter conditions min. max. unit v cc supply voltage - 0.3 +8.0 v t amb ambient temperature - 40 +85 c t stg storage temperature - 55 +125 c v es electrostatic handling voltage note 1 pins osc and ose - 2000 +1500 v pins lfb and mixin - 1500 +2000 v all other pins - 2000 +2000 v symbol parameter conditions value unit r th(j-a) thermal resistance from junction to ambient in free air 105 k/w symbol parameter conditions min. typ. max. unit v cc supply voltage 3.5 - 6.0 v i cc supply current r2 = 680 w- 3.4 4.8 ma v oh(data) high-level output voltage at pin data i data = - 10 m a; note 1 v cc - 0.5 - v cc v v ol(data) low-level output voltage at pin data i data = +200 m a; note 1 0 - 0.6 v
2000 apr 18 6 philips semiconductors product speci?cation uhf/vhf remote control receiver UAA3201t ac characteristics v cc = 3.5 v; t amb =25 c; for test circuit see fig.9; r1 disconnected; for ac test conditions see section ac test conditions; unless otherwise speci?ed. notes 1. p ref is the maximum available power at the input of the test board. the bit error rate (ber) is measured using the test facility shown in fig.8. 2. valid only for the reference pcb (see figs 10 and 11). spurious radiation is strongly dependent on the pcb layout. 3. the supply voltage v cc is pulsed as explained in fig.3. internal pin configuration symbol parameter conditions min. typ. max. unit p ref input reference sensitivity ber 3 10 - 2 ; note 1 --- 105 dbm p i(max) maximum input power ber 3 10 - 2 --- 30 dbm p spur spurious radiation note 2 --- 60 dbm ip3 mix interception point (mixer) - 20 - 17 - dbm ip3 if interception point (mixer plus if ampli?er) - 38 - 35 - dbm p 1db 1 db compression point (mixer) - 38 - 35 - dbm t on(rx) receiver turn-on time note 3 -- 10 ms pin symbol equivalent circuit 1 mon 2 mop 3v cc 4 osc 5 ose 2 1 1.5 k w 1.5 k w mhb680 v p from oscillator buffer 3 v cc mhb681 4 5 6 k w 1.2 v v p mhb682
2000 apr 18 7 philips semiconductors product speci?cation uhf/vhf remote control receiver UAA3201t 6v ee 7 cpb 8cpa 9 data 10 cpo 11 cpc pin symbol equivalent circuit 6 mhb683 8 7 150 k w 150 k w mhb684 v p 9 1 k w mhb686 v p mhb685 v p 10 30 k w mhb704 v p 11
2000 apr 18 8 philips semiconductors product speci?cation uhf/vhf remote control receiver UAA3201t test information tuning procedure for ac tests 1. turn on the signal generator: f i(rf) = 433.92 mhz, no modulation and rf input leve l=1mv. 2. tune capacitor c6 (rf stage input) to obtain a maximum voltage on pin lin. 3. check that data is appearing on pin data and proceed with the ac tests. ac test conditions the reference signal level p ref for the following tests is defined as the minimum input level in dbm to give a ber 3 10 - 2 (e.g. 7.5 bit errors per second for 250 bits/s). 12 lfb 13 lin 14 mxin 15 v em 16 fa pin symbol equivalent circuit 13 12 50 k w mhb687 v p 14 15 mhb688 16 1.4 k w mhb689 v p
2000 apr 18 9 philips semiconductors product speci?cation uhf/vhf remote control receiver UAA3201t table 1 test signals test results p 1 is the maximum available power from signal generator 1 at the input of the test board; p 2 is the maximum available power from signal generator 2 at the input of the test board. table 2 test results notes 1. the supply voltage v cc of the test circuit alternates between on (100 ms) and off (100 ms); see fig.3. 2. differential probe of spectrum analyser connected to pins mop and mon. 3. probe of spectrum analyser connected to pin lin. 4. spectrum analyser connected to the input of the test board. 5. probe of spectrum analyser connected to either pin mop or pin mon. test signal frequency (mhz) data signal modulation modulation index 1 433.92 250 bits/s (square wave) rz signal with duty cycle of 66% for logic 1; rz signal with duty cycle of 33% for logic 0 100% 2 434.02 - no modulation - 3 433.92 - no modulation - test generator result 12 maximum input power; see fig.4 test signal 1; p 1 = - 30 dbm (minimum p max ) - ber 3 10 - 2 (e.g. 7.5 bit errors per second for 250 bits/s) receiver turn-on time; see fig.4 and note 1 test signal 1; p 1 =p ref +10db - check that the ?rst 10 bits are correct; error counting is started 10 ms after v cc is switched on interception point (mixer); see fig.5 and note 2 test signal 3; p 1 = - 50 dbm test signal 2; p 2 =p 1 ip3 = p 1 + 1 2 im3 (db); minimum value: ip3 mix 3- 20 dbm interception point (mixer plus if ampli?er); see fig.5 and note 3 test signal 3; p 1 = - 50 dbm test signal 2; p 2 =p 1 ip3 = p 1 + 1 2 im3 (db); minimum value: ip3 if 3- 38 dbm spurious radiation; see fig.6 and note 4 -- no spurious radiation (25 mhz to 1 ghz) with level higher than - 60 dbm (maximum p spur ) 1 db compression point (mixer); see fig.7 and note 5 test signal 3; p 11 = - 70 dbm; p 12 = - 38 dbm (minimum p 1db ) - (p o1 + 70 db) - [p o2 + 38 db (minimum p 1db )] 1db, where p o1 is the output power for test signal with p 11 and p o2 is the output power for test signal with p 12
2000 apr 18 10 philips semiconductors product speci?cation uhf/vhf remote control receiver UAA3201t t (ms) 300 200 100 0 0 3.5 v cc (v) med899 - 1 fig.3 timing diagram for pulsed supply voltage. test circuit (1) (2) generator 1 50 w med900 ber test facility fig.4 test configuration (single generator). (1) for test circuit see fig.9. (2) for ber test facility see fig.8. spectrum analyzer with probe test circuit (1) generator 1 50 w 2-signal power combiner 50 w generator 2 50 w med901 d f d f = 100 khz d f d f im3 fig.5 test configuration (interception point). (1) for test circuit see fig.9.
2000 apr 18 11 philips semiconductors product speci?cation uhf/vhf remote control receiver UAA3201t spectrum analyzer input impedance 50 w test circuit (1) med902 (1) for test circuit see fig.9. fig.6 test configuration (spurious radiation). (1) for test circuit see fig.9. spectrum analyzer with probe test circuit (1) generator 1 50 w med903 fig.7 test configuration (1 db compression point). device under test signal generator master clock bit pattern generator preset delay data comparator integrate and dump rx data ber test board to error counter tx data med904 delayed tx data fig.8 ber test facility.
2000 apr 18 12 philips semiconductors product speci?cation uhf/vhf remote control receiver UAA3201t application information handbook, full pagewidth med896 c6 mixer if amp oscillator band gap reference c3 c2 c1 buffer comparator limiter c9 c5 l1 c4 c15 c12 c17 c11 c8 c20 l2 l3 c10 c19 rf_in + 3.5 v 3.5 v r1 data v cc v cc v ref v ee c7 sawr r3 c16 c18 l4 r2 c21 c14 c13 (1) 16 fa mon mop osc ose cpb cpa v em mixin lin lfb cpc cpo data 15 14 13 12 11 10 9 1 2 3456 78 buffer UAA3201t fig.9 application and test circuit. (1) stray inductance. fig.9 application and test circuit.
2000 apr 18 13 philips semiconductors product speci?cation uhf/vhf remote control receiver UAA3201t components and layout of printed circuit board of test circuit for f i(rf) = 433.92 mhz table 3 components list for fig.9 table 4 sawr data component value tolerance description r1 27 k w 2% tc = +50 ppm/k r2 680 w 2% tc = +50 ppm/k r3 220 w 2% tc = +50 ppm/k c1 4.7 m f 20% - c2 150 pf 10% tc = 0 30 ppm/k; tan d 10 10 - 4 ; f = 1 mhz c3 1 nf 10% tc = 0 30 ppm/k; tan d 10 10 - 4 ; f = 1 mhz c4 820 pf 10% tc = 0 30 ppm/k; tan d 10 10 - 4 ; f = 1 mhz c5 3.3 pf 10% tc = 0 150 ppm/k; tan d 30 10 - 4 ; f = 1 mhz c6 2.5 to 6 pf - tc = 0 300 ppm/k; tan d 20 10 - 4 ; f = 1 mhz c7 56 pf 10% tc = 0 30 ppm/k; tan d 10 10 - 4 ; f = 1 mhz c8 150 pf 10% tc = 0 30 ppm/k; tan d 10 10 - 4 ; f = 1 mhz c9 220 pf 10% tc = 0 30 ppm/k; tan d 10 10 - 4 ; f = 1 mhz c10 27 pf 10% tc = 0 30 ppm/k; tan d 20 10 - 4 ; f = 1 mhz c11 150 pf 10% tc = 0 30 ppm/k; tan d 10 10 - 4 ; f = 1 mhz c12 100 nf 10% tan d 25 10 - 3 ; f = 1 khz c13 2.2 nf 10% tan d 25 10 - 3 ; f = 1 khz c14 33 nf 10% tan d 25 10 - 3 ; f = 1 khz c15 150 pf 10% tc = 0 30 ppm/k; tan d 10 10 - 4 ; f = 1 mhz c16 3.9 pf 10% tc = 0 150 ppm/k; tan d 30 10 - 4 ; f = 1 mhz c17 10 nf 10% tan d 25 10 - 3 ; f = 1 khz c18 3.3 pf 10% tc = 0 150 ppm/k; tan d 30 10 - 4 ; f = 1 mhz c19 68 pf 10% tc = 0 30 ppm/k; tan d 10 10 - 4 ; f = 1 mhz c20 6.8 pf 10% tc = 0 150 ppm/k; tan d 30 10 - 4 ; f = 1 mhz c21 47 pf 5% tc = 0 30 ppm/k; tan d 10 10 - 4 ; f = 1 mhz l1 10 nh 10% q min = 50 to 450 mhz; tc = 25 to 125 ppm/k l2 330 m h 10% q min = 45 to 800 khz; c stray 1pf l3 330 m h 10% q min = 45 to 800 khz; c stray 1pf l4 33 nh 10% q min = 45 to 450 mhz; tc = 25 to 125 ppm/k sawr -- see table 4 description specification type one-port (e.g. rfm r02112) centre frequency 433.42 mhz 75 khz maximum insertion loss 1.5 db typical loaded q 1600 (50 w load) temperature drift 0.032 ppm/k 2 turnover temperature 43 c
2000 apr 18 14 philips semiconductors product speci?cation uhf/vhf remote control receiver UAA3201t fig.10 layout top side. rf_in data h4acs15 UAA3201t n.c. mbe589 fig.11 layout bottom side. pcalh/h4acs15 h4acs15 mbe591
2000 apr 18 15 philips semiconductors product speci?cation uhf/vhf remote control receiver UAA3201t fig.12 top side with components. rf_in data UAA3201t n.c. mbe590 c5 c4 l2 l1 l3 c15 c13 c14 r1 c12 c17 c19 c6 data ic1 sawr supply h4acs15 fig.12 top side with components. fig.13 bottom side with components. pcalh/h4acs15 c11 c10 c16 c9 c20 c8 c7 c18 c1 c2 c21 c3 r3 r2 l4 h4acs15 mbe592
2000 apr 18 16 philips semiconductors product speci?cation uhf/vhf remote control receiver UAA3201t package outline x w m q a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 8 9 1 16 y pin 1 index unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec eiaj mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.0 0.4 sot109-1 97-05-22 99-12-27 076e07 ms-012 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.39 0.38 0.16 0.15 0.050 1.05 0.041 0.244 0.228 0.028 0.020 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 0 2.5 5 mm scale so16: plastic small outline package; 16 leads; body width 3.9 mm sot109-1
2000 apr 18 17 philips semiconductors product speci?cation uhf/vhf remote control receiver UAA3201t soldering introduction to soldering surface mount packages this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all surface mount ic packages. wave soldering is not always suitable for surface mount ics, or for printed-circuit boards with high population densities. in these situations reflow soldering is often used. re?ow soldering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. typical reflow peak temperatures range from 215 to 250 c. the top-surface temperature of the packages should preferable be kept below 230 c. wave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was specifically developed. if wave soldering is used the following conditions must be observed for optimal results: use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. manual soldering fix the component by first soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c.
2000 apr 18 18 philips semiconductors product speci?cation uhf/vhf remote control receiver UAA3201t suitability of surface mount ic packages for wave and re?ow soldering methods notes 1. all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . 2. these packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. 4. wave soldering is only suitable for lqfp, tqfp and qfp packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. wave soldering is only suitable for ssop and tssop packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. package soldering method wave reflow (1) bga, lfbga, sqfp, tfbga not suitable suitable hbcc, hlqfp, hsqfp, hsop, htqfp, htssop, sms not suitable (2) suitable plcc (3) , so, soj suitable suitable lqfp, qfp, tqfp not recommended (3)(4) suitable ssop, tssop, vso not recommended (5) suitable
2000 apr 18 19 philips semiconductors product speci?cation uhf/vhf remote control receiver UAA3201t data sheet status note 1. please consult the most recently issued data sheet before initiating or completing a design. data sheet status product status definitions (1) objective speci?cation development this data sheet contains the design target or goal speci?cations for product development. speci?cation may change in any manner without notice. preliminary speci?cation quali?cation this data sheet contains preliminary data, and supplementary data will be published at a later date. philips semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. product speci?cation production this data sheet contains ?nal speci?cations. philips semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. definitions short-form specification ? the data in a short-form specification is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values definition ? limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the specification is not implied. exposure to limiting values for extended periods may affect device reliability. application information ? applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. disclaimers life support applications ? these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes ? philips semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
? philips electronics n.v. sca all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. internet: http://www.semiconductors.philips.com 2000 69 philips semiconductors C a worldwide company for all other countries apply to: philips semiconductors, international marketing & sales communications, building be-p, p.o. box 218, 5600 md eindhoven, the netherlands, fax. +31 40 27 24825 argentina: see south america australia: 3 figtree drive, homebush, nsw 2140, tel. +61 2 9704 8141, fax. +61 2 9704 8139 austria: computerstr. 6, a-1101 wien, p.o. box 213, tel. +43 1 60 101 1248, fax. +43 1 60 101 1210 belarus: hotel minsk business center, bld. 3, r. 1211, volodarski str. 6, 220050 minsk, tel. +375 172 20 0733, fax. +375 172 20 0773 belgium: see the netherlands brazil: see south america bulgaria: philips bulgaria ltd., energoproject, 15th floor, 51 james bourchier blvd., 1407 sofia, tel. +359 2 68 9211, fax. +359 2 68 9102 canada: philips semiconductors/components, tel. +1 800 234 7381, fax. +1 800 943 0087 china/hong kong: 501 hong kong industrial technology centre, 72 tat chee avenue, kowloon tong, hong kong, tel. +852 2319 7888, fax. +852 2319 7700 colombia: see south america czech republic: see austria denmark: sydhavnsgade 23, 1780 copenhagen v, tel. +45 33 29 3333, fax. +45 33 29 3905 finland: sinikalliontie 3, fin-02630 espoo, tel. +358 9 615 800, fax. +358 9 6158 0920 france: 51 rue carnot, bp317, 92156 suresnes cedex, tel. +33 1 4099 6161, fax. +33 1 4099 6427 germany: hammerbrookstra?e 69, d-20097 hamburg, tel. +49 40 2353 60, fax. +49 40 2353 6300 hungary: see austria india: philips india ltd, band box building, 2nd floor, 254-d, dr. annie besant road, worli, mumbai 400 025, tel. +91 22 493 8541, fax. +91 22 493 0966 indonesia: pt philips development corporation, semiconductors division, gedung philips, jl. buncit raya kav.99-100, jakarta 12510, tel. +62 21 794 0040 ext. 2501, fax. +62 21 794 0080 ireland: newstead, clonskeagh, dublin 14, tel. +353 1 7640 000, fax. +353 1 7640 200 israel: rapac electronics, 7 kehilat saloniki st, po box 18053, tel aviv 61180, tel. +972 3 645 0444, fax. +972 3 649 1007 italy: philips semiconductors, via casati, 23 - 20052 monza (mi), tel. +39 039 203 6838, fax +39 039 203 6800 japan: philips bldg 13-37, kohnan 2-chome, minato-ku, tokyo 108-8507, tel. +81 3 3740 5130, fax. +81 3 3740 5057 korea: philips house, 260-199 itaewon-dong, yongsan-ku, seoul, tel. +82 2 709 1412, fax. +82 2 709 1415 malaysia: no. 76 jalan universiti, 46200 petaling jaya, selangor, tel. +60 3 750 5214, fax. +60 3 757 4880 mexico: 5900 gateway east, suite 200, el paso, texas 79905, tel. +9-5 800 234 7381, fax +9-5 800 943 0087 middle east: see italy netherlands: postbus 90050, 5600 pb eindhoven, bldg. vb, tel. +31 40 27 82785, fax. +31 40 27 88399 new zealand: 2 wagener place, c.p.o. box 1041, auckland, tel. +64 9 849 4160, fax. +64 9 849 7811 norway: box 1, manglerud 0612, oslo, tel. +47 22 74 8000, fax. +47 22 74 8341 pakistan: see singapore philippines: philips semiconductors philippines inc., 106 valero st. salcedo village, p.o. box 2108 mcc, makati, metro manila, tel. +63 2 816 6380, fax. +63 2 817 3474 poland : al.jerozolimskie 195 b, 02-222 warsaw, tel. +48 22 5710 000, fax. +48 22 5710 001 portugal: see spain romania: see italy russia: philips russia, ul. usatcheva 35a, 119048 moscow, tel. +7 095 755 6918, fax. +7 095 755 6919 singapore: lorong 1, toa payoh, singapore 319762, tel. +65 350 2538, fax. +65 251 6500 slovakia: see austria slovenia: see italy south africa: s.a. philips pty ltd., 195-215 main road martindale, 2092 johannesburg, p.o. box 58088 newville 2114, tel. +27 11 471 5401, fax. +27 11 471 5398 south america: al. vicente pinzon, 173, 6th floor, 04547-130 s?o paulo, sp, brazil, tel. +55 11 821 2333, fax. +55 11 821 2382 spain: balmes 22, 08007 barcelona, tel. +34 93 301 6312, fax. +34 93 301 4107 sweden: kottbygatan 7, akalla, s-16485 stockholm, tel. +46 8 5985 2000, fax. +46 8 5985 2745 switzerland: allmendstrasse 140, ch-8027 zrich, tel. +41 1 488 2741 fax. +41 1 488 3263 taiwan: philips semiconductors, 6f, no. 96, chien kuo n. rd., sec. 1, taipei, taiwan tel. +886 2 2134 2886, fax. +886 2 2134 2874 thailand: philips electronics (thailand) ltd., 209/2 sanpavuth-bangna road prakanong, bangkok 10260, tel. +66 2 745 4090, fax. +66 2 398 0793 turkey: yukari dudullu, org. san. blg., 2.cad. nr. 28 81260 umraniye, istanbul, tel. +90 216 522 1500, fax. +90 216 522 1813 ukraine : philips ukraine, 4 patrice lumumba str., building b, floor 7, 252042 kiev, tel. +380 44 264 2776, fax. +380 44 268 0461 united kingdom: philips semiconductors ltd., 276 bath road, hayes, middlesex ub3 5bx, tel. +44 208 730 5000, fax. +44 208 754 8421 united states: 811 east arques avenue, sunnyvale, ca 94088-3409, tel. +1 800 234 7381, fax. +1 800 943 0087 uruguay: see south america vietnam: see singapore yugoslavia: philips, trg n. pasica 5/v, 11000 beograd, tel. +381 11 3341 299, fax.+381 11 3342 553 printed in the netherlands 03/pp 20 date of release: 2000 apr 18 document order number: 9397 750 06929

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